Senior FOL Engineer (Wire Bond) – Kedah
AIC Semiconductor Sdn. Bhd.
勤務地
Kedah
求人詳細
Responsibilities:
Able to identify, develop and resolve process related issues forcontinuous improvement in yield, quality & reliability and productivity.
Able to provide engineering solutions/support to assembly operations;
Involved in process development and optimization for newdevice/package.
Lead a team of engineers and technicians to achieve operation goals inyield, quality, output, on time delivery, productivity, cycle time and cost.
Requirements:
Degree in Electrical/Electronic/Mechanical Engineering or equivalenttechnology related qualification;
Minimum 3 - 5 years ; experience in IC assembly manufacturingoperations, preferably in Wire bond process.
A team player with strong analytical abilities, problem-solving skills.
Leadership ability in driving a team of engineers and technicians to meetprocess capability, yields and throughput targets;
Good communication skills in English
Education: Bachelor (Preferred)
Language: English (Preferred), Mandarin (Preferred), Bahasa (Preferred
